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March 10, 2010 FREE MAGAZINE SUBSCRIPTION (PRINT OR DIGITAL) TOP STORY TierLogic lifts the veil: another take on the 3D FPGA EDN Executive Editor Ron Wilson analyzes TierLogic, a large and expensive FPGA start-up that has been in stealth mode for years. Today the company unveiled a radical approach to increasing the density and utility of large programmable logic devices, and like previously-announced Tabula, TierLogic describes its design as a 3D FPGA. Read more about how the two approaches are totally unlike each other, and neither is related to the concept of 3D ICs—involving stacked dice and through-silicon vias—that is currently the hot topic in SoC-of-the-future circles, in this Practical Chip Design blog entry. Read more >> For another take on TierLogic, see the FPGA Gurus blog: Tier Logic’s Threefold Path MORE NEWS AND COMMENTARY Hardware and O/S virtualization, CPU expansion: delusions amidst the conceptions Tying up loose ends Tekton Energizer battery charger opens backdoor on unwary owners OK Go’s Rube Goldberg Machine Gate first, or gate last: technologists debate high-k Cost of 32-bit microcontrollers is tumbling MORE ARTICLES >> ADVERTISEMENT Support Across The Board. From Design to Delivery. Now, you can have it all, faster and easier than ever before. Avnet’s commitment to customer service is backed by an extensive product offering combined with supply chain and design chain services, and a world-class ecommerce offering. Ready. Set. Go to Market. Click Here. FEATURED BLOG Embedded Processing Technical Editor Robert Cravotta explores processor and software-processing architectures and the impact they have on system and software development. Relevant architectures include microprocessors, microcontrollers, digital signal processors (DSPs), multiprocessor architectures, processor fabrics, coprocessors, and accelerators, plus embedded cores in FPGAs, SOCs, and ASICs. Read more >> JOIN THE CONVERSATION AND STAY CONNECTED WITH EDN ON: ADVERTISEMENT Now Showing: DualCool NexFET power MOSFETs: Industry’s first standard footprint mosfet that allows 80% higher power dissipation and conducts 50% more current. Watch the video now! For more information, click here!

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